Name: GIGABYTE B660M DS3H DDR4 INTEL 12TH GENERATION MOTHERBOARD - Multimedia Computer
Availability: OutOfStock

GIGABYTE B660M DS3H DDR4 INTEL 12TH GENERATION MOTHERBOARD

KEY FEATURES

CPU SOCKET TYPE: LGA 1700
MOTHERBOARD CHIPSET: B660
AUDIO : REALTEK AUDIO CODEC
FORM FACTOR : MICRO ATX

Out of stock

Description

SPECIFICATION


SUPPORTED CPU	LGA1700 SOCKET: SUPPORT FOR 12TH GENERATION INTEL CORE, PENTIUM GOLD AND CELERON PROCESSORS L3 CACHE VARIES WITH CPU
CHIPSET	INTEL B660 EXPRESS CHIPSET
BIOS	1 X 256 MBIT FLASH USE OF LICENSED AMI UEFI BIOS PNP 1.0A, DMI 2.7, WFM 2.0, SM BIOS 2.7, ACPI 5.0
FORM FACTOR	MICRO ATX FORM FACTOR; 24.4CM X 24.4CM
AUDIO	REALTEK AUDIO CODEC HIGH DEFINITION AUDIO 2/4/5.1/7.1-CHANNEL * TO CONFIGURE 7.1-CHANNEL AUDIO, YOU NEED TO OPEN THE AUDIO SOFTWARE AND SELECT DEVICE ADVANCED SETTINGS > PLAYBACK DEVICE TO CHANGE THE DEFAULT SETTING FIRST.
EXPANSION SLOTS
PCI	1 X PCI EXPRESS X16 SLOT, RUNNING AT X16 (THE PCIEX16 SLOT CONFORMS TO PCI EXPRESS 4.0 STANDARD.) 2 X PCI EXPRESS X1 SLOTS (THE PCIEX1 SLOTS CONFORM TO PCI EXPRESS 3.0 STANDARD.)
MEMORY
TYPE	DDR4
SLOTS	4 X DDR DIMM SOCKETS
SUPPORTED MEMORY	SUPPORT FOR DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHZ MEMORY MODULES DUAL CHANNEL MEMORY ARCHITECTURE SUPPORT FOR ECC UN-BUFFERED DIMM 1RX8/2RX8 MEMORY MODULES (OPERATE IN NON-ECC MODE) SUPPORT FOR NON-ECC UN-BUFFERED DIMM 1RX8/2RX8/1RX16 MEMORY MODULES SUPPORT FOR EXTREME MEMORY PROFILE (XMP) MEMORY MODULES
MAXIMUM MEMORY	UP TO 128 GB (32 GB SINGLE DIMM CAPACITY) OF SYSTEM MEMORY
GRAPHICS
GRAPHICS	INTEGRATED GRAPHICS PROCESSOR-INTEL HD GRAPHICS SUPPORT: 1 X HDMI PORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2160@60 HZ * SUPPORT FOR HDMI 2.1 VERSION AND HDCP 2.3. ** SUPPORT NATIVE HDMI 2.1 TMDS COMPATIBLE PORTS. 1 X DISPLAYPORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2304@60 HZ * SUPPORT FOR DISPLAYPORT 1.2 VERSION AND HDCP 2.3 1 X DISPLAYPORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2304@60 HZ * SUPPORT FOR DISPLAYPORT 1.2 VERSION. SUPPORT FOR UP TO 3 DISPLAYS AT THE SAME TIME
CONNECTOR & PORTS
HDMI	1 X HDMI PORT
DISPLAY PORT (S)	2 X DISPLAYPORT
USB (S)	CHIPSET: 1 X USB TYPE-C PORT ON THE BACK PANEL, WITH USB 3.2 GEN 2 SUPPORT 5 X USB 3.2 GEN 1 PORTS (3 PORTS ON THE BACK PANEL, 2 PORTS AVAILABLE THROUGH THE INTERNAL USB HEADER) 2 X USB 2.0/1.1 PORTS ON THE BACK PANEL CHIPSET+2 USB 2.0 HUBS: 4 X USB 2.0/1.1 PORTS AVAILABLE THROUGH THE INTERNAL USB HEADERS
LAN PORT (S)	REALTEK 2.5GBE LAN CHIP (2.5 GBPS/1 GBPS/100 MBPS)
WIRELESS COMMUNICATION MODULE	INTEL WI-FI 6 AX201 (FOR PCB REV. 1.0) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5 GHZ DUAL-BAND BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE INTEL WI-FI 6 AX200 (FOR PCB REV. 1.1) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5 GHZ DUAL-BAND BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE INTEL WI-FI 6E AX211 (FOR PCB REV. 1.2) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5/6 GHZ CARRIER FREQUENCY BANDS BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE
SUPPORTED STORAGE	CPU: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2A_CPU) CHIPSET: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2P_SB) 4 X SATA 6GB/S CONNECTORS SUPPORT FOR RAID 0, RAID 1, RAID 5, AND RAID 10 INTEL OPTANE MEMORY READY
AUDIO	3 X AUDIO JACKS
INTERNAL I/O PORTS	1 X 24-PIN ATX MAIN POWER CONNECTOR 1 X 8-PIN ATX 12V POWER CONNECTOR 1 X CPU FAN HEADER 3 X SYSTEM FAN HEADERS 1 X ADDRESSABLE LED STRIP HEADER 1 X RGB LED STRIP HEADER 2 X M.2 SOCKET 3 CONNECTORS 4 X SATA 6GB/S CONNECTORS 1 X FRONT PANEL HEADER 1 X FRONT PANEL AUDIO HEADER 1 X USB 3.2 GEN 1 HEADER 2 X USB 2.0/1.1 HEADERS 1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY) 1 X S/PDIF OUT HEADER 1 X Q-FLASH PLUS BUTTON 1 X RESET BUTTON 1 X RESET JUMPER 1 X CLEAR CMOS JUMPER
TPM (TRUSTED PLATFORM MODULE )	1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY)
WARRANTY INFORMATION
MANUFACTURING WARRANTY	3 YEARS

-100%Sold out

GIGABYTE B660M DS3H DDR4 INTEL 12TH GENERATION MOTHERBOARD

Click to enlarge

Back to products

Original price was: ৳ 13,000.00.Current price is: ৳ 0.00.

Compare

Add to wishlist

Categories: COMPONENT, GIGABYTE, MOTHERBOARD

Description
Reviews (0)


SUPPORTED CPU	LGA1700 SOCKET: SUPPORT FOR 12TH GENERATION INTEL CORE, PENTIUM GOLD AND CELERON PROCESSORS L3 CACHE VARIES WITH CPU
CHIPSET	INTEL B660 EXPRESS CHIPSET
BIOS	1 X 256 MBIT FLASH USE OF LICENSED AMI UEFI BIOS PNP 1.0A, DMI 2.7, WFM 2.0, SM BIOS 2.7, ACPI 5.0
FORM FACTOR	MICRO ATX FORM FACTOR; 24.4CM X 24.4CM
AUDIO	REALTEK AUDIO CODEC HIGH DEFINITION AUDIO 2/4/5.1/7.1-CHANNEL * TO CONFIGURE 7.1-CHANNEL AUDIO, YOU NEED TO OPEN THE AUDIO SOFTWARE AND SELECT DEVICE ADVANCED SETTINGS > PLAYBACK DEVICE TO CHANGE THE DEFAULT SETTING FIRST.
EXPANSION SLOTS
PCI	1 X PCI EXPRESS X16 SLOT, RUNNING AT X16 (THE PCIEX16 SLOT CONFORMS TO PCI EXPRESS 4.0 STANDARD.) 2 X PCI EXPRESS X1 SLOTS (THE PCIEX1 SLOTS CONFORM TO PCI EXPRESS 3.0 STANDARD.)
MEMORY
TYPE	DDR4
SLOTS	4 X DDR DIMM SOCKETS
SUPPORTED MEMORY	SUPPORT FOR DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHZ MEMORY MODULES DUAL CHANNEL MEMORY ARCHITECTURE SUPPORT FOR ECC UN-BUFFERED DIMM 1RX8/2RX8 MEMORY MODULES (OPERATE IN NON-ECC MODE) SUPPORT FOR NON-ECC UN-BUFFERED DIMM 1RX8/2RX8/1RX16 MEMORY MODULES SUPPORT FOR EXTREME MEMORY PROFILE (XMP) MEMORY MODULES
MAXIMUM MEMORY	UP TO 128 GB (32 GB SINGLE DIMM CAPACITY) OF SYSTEM MEMORY
GRAPHICS
GRAPHICS	INTEGRATED GRAPHICS PROCESSOR-INTEL HD GRAPHICS SUPPORT: 1 X HDMI PORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2160@60 HZ * SUPPORT FOR HDMI 2.1 VERSION AND HDCP 2.3. ** SUPPORT NATIVE HDMI 2.1 TMDS COMPATIBLE PORTS. 1 X DISPLAYPORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2304@60 HZ * SUPPORT FOR DISPLAYPORT 1.2 VERSION AND HDCP 2.3 1 X DISPLAYPORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2304@60 HZ * SUPPORT FOR DISPLAYPORT 1.2 VERSION. SUPPORT FOR UP TO 3 DISPLAYS AT THE SAME TIME
CONNECTOR & PORTS
HDMI	1 X HDMI PORT
DISPLAY PORT (S)	2 X DISPLAYPORT
USB (S)	CHIPSET: 1 X USB TYPE-C PORT ON THE BACK PANEL, WITH USB 3.2 GEN 2 SUPPORT 5 X USB 3.2 GEN 1 PORTS (3 PORTS ON THE BACK PANEL, 2 PORTS AVAILABLE THROUGH THE INTERNAL USB HEADER) 2 X USB 2.0/1.1 PORTS ON THE BACK PANEL CHIPSET+2 USB 2.0 HUBS: 4 X USB 2.0/1.1 PORTS AVAILABLE THROUGH THE INTERNAL USB HEADERS
LAN PORT (S)	REALTEK 2.5GBE LAN CHIP (2.5 GBPS/1 GBPS/100 MBPS)
WIRELESS COMMUNICATION MODULE	INTEL WI-FI 6 AX201 (FOR PCB REV. 1.0) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5 GHZ DUAL-BAND BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE INTEL WI-FI 6 AX200 (FOR PCB REV. 1.1) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5 GHZ DUAL-BAND BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE INTEL WI-FI 6E AX211 (FOR PCB REV. 1.2) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5/6 GHZ CARRIER FREQUENCY BANDS BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE
SUPPORTED STORAGE	CPU: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2A_CPU) CHIPSET: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2P_SB) 4 X SATA 6GB/S CONNECTORS SUPPORT FOR RAID 0, RAID 1, RAID 5, AND RAID 10 INTEL OPTANE MEMORY READY
AUDIO	3 X AUDIO JACKS
INTERNAL I/O PORTS	1 X 24-PIN ATX MAIN POWER CONNECTOR 1 X 8-PIN ATX 12V POWER CONNECTOR 1 X CPU FAN HEADER 3 X SYSTEM FAN HEADERS 1 X ADDRESSABLE LED STRIP HEADER 1 X RGB LED STRIP HEADER 2 X M.2 SOCKET 3 CONNECTORS 4 X SATA 6GB/S CONNECTORS 1 X FRONT PANEL HEADER 1 X FRONT PANEL AUDIO HEADER 1 X USB 3.2 GEN 1 HEADER 2 X USB 2.0/1.1 HEADERS 1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY) 1 X S/PDIF OUT HEADER 1 X Q-FLASH PLUS BUTTON 1 X RESET BUTTON 1 X RESET JUMPER 1 X CLEAR CMOS JUMPER
TPM (TRUSTED PLATFORM MODULE )	1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY)
WARRANTY INFORMATION
MANUFACTURING WARRANTY	3 YEARS

Reviews (0)

Reviews

There are no reviews yet.

Be the first to review “GIGABYTE B660M DS3H DDR4 INTEL 12TH GENERATION MOTHERBOARD”

GIGABYTE B660M DS3H DDR4 INTEL 12TH GENERATION MOTHERBOARD

KEY FEATURES

CPU SOCKET TYPE: LGA 1700

MOTHERBOARD CHIPSET: B660

AUDIO : REALTEK AUDIO CODEC

FORM FACTOR : MICRO ATX

Description

SPECIFICATION

SUPPORTED CPU

LGA1700 SOCKET: SUPPORT FOR 12TH GENERATION INTEL CORE, PENTIUM GOLD AND CELERON PROCESSORS L3 CACHE VARIES WITH CPU

CHIPSET

INTEL B660 EXPRESS CHIPSET

BIOS

1 X 256 MBIT FLASH USE OF LICENSED AMI UEFI BIOS PNP 1.0A, DMI 2.7, WFM 2.0, SM BIOS 2.7, ACPI 5.0

FORM FACTOR

MICRO ATX FORM FACTOR; 24.4CM X 24.4CM

AUDIO

REALTEK AUDIO CODEC HIGH DEFINITION AUDIO 2/4/5.1/7.1-CHANNEL * TO CONFIGURE 7.1-CHANNEL AUDIO, YOU NEED TO OPEN THE AUDIO SOFTWARE AND SELECT DEVICE ADVANCED SETTINGS > PLAYBACK DEVICE TO CHANGE THE DEFAULT SETTING FIRST.

EXPANSION SLOTS

PCI

1 X PCI EXPRESS X16 SLOT, RUNNING AT X16 (THE PCIEX16 SLOT CONFORMS TO PCI EXPRESS 4.0 STANDARD.) 2 X PCI EXPRESS X1 SLOTS (THE PCIEX1 SLOTS CONFORM TO PCI EXPRESS 3.0 STANDARD.)

MEMORY

TYPE

DDR4

SLOTS

4 X DDR DIMM SOCKETS

SUPPORTED MEMORY

MAXIMUM MEMORY

UP TO 128 GB (32 GB SINGLE DIMM CAPACITY) OF SYSTEM MEMORY

GRAPHICS

GRAPHICS

CONNECTOR & PORTS

HDMI

1 X HDMI PORT

DISPLAY PORT (S)

2 X DISPLAYPORT

USB (S)

LAN PORT (S)

REALTEK 2.5GBE LAN CHIP (2.5 GBPS/1 GBPS/100 MBPS)

WIRELESS COMMUNICATION MODULE

SUPPORTED STORAGE

CPU: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2A_CPU) CHIPSET: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2P_SB) 4 X SATA 6GB/S CONNECTORS SUPPORT FOR RAID 0, RAID 1, RAID 5, AND RAID 10 INTEL OPTANE MEMORY READY

AUDIO

3 X AUDIO JACKS

INTERNAL I/O PORTS

TPM (TRUSTED PLATFORM MODULE )

1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY)

WARRANTY INFORMATION

MANUFACTURING WARRANTY

3 YEARS

Reviews

Related products

Sign in

LGA1700 SOCKET: SUPPORT FOR 12TH GENERATION INTEL CORE, PENTIUM GOLD AND CELERON PROCESSORS
L3 CACHE VARIES WITH CPU

1 X 256 MBIT FLASH
USE OF LICENSED AMI UEFI BIOS
PNP 1.0A, DMI 2.7, WFM 2.0, SM BIOS 2.7, ACPI 5.0

REALTEK AUDIO CODEC
HIGH DEFINITION AUDIO
2/4/5.1/7.1-CHANNEL
* TO CONFIGURE 7.1-CHANNEL AUDIO, YOU NEED TO OPEN THE AUDIO SOFTWARE AND SELECT DEVICE ADVANCED SETTINGS > PLAYBACK DEVICE TO CHANGE THE DEFAULT SETTING FIRST.

1 X PCI EXPRESS X16 SLOT, RUNNING AT X16
(THE PCIEX16 SLOT CONFORMS TO PCI EXPRESS 4.0 STANDARD.)
2 X PCI EXPRESS X1 SLOTS
(THE PCIEX1 SLOTS CONFORM TO PCI EXPRESS 3.0 STANDARD.)

CPU:
1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2A_CPU)
CHIPSET:
1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2P_SB)
4 X SATA 6GB/S CONNECTORS
SUPPORT FOR RAID 0, RAID 1, RAID 5, AND RAID 10

INTEL OPTANE MEMORY READY