Name: GIGABYTE B660M DS3H AX DDR4 INTEL 12TH GENERATION MOTHERBOARD - Multimedia Computer
Price: 13400.00 BDT
Availability: OutOfStock

GIGABYTE B660M DS3H AX DDR4 INTEL 12TH GENERATION MOTHERBOARD

KEY FEATURES

CPU SOCKET TYPE: LGA 1700
MOTHERBOARD CHIPSET: B660
AUDIO: REALTEK AUDIO CODEC
FORM FACTOR: MICRO ATX

Out of stock

Description

SPECIFICATION


SUPPORTED CPU	LGA1700 SOCKET: SUPPORT FOR 12TH GENERATION INTEL CORE, PENTIUM GOLD AND CELERON PROCESSORS L3 CACHE VARIES WITH CPU
CHIPSET	INTEL B660 EXPRESS CHIPSET
BIOS	1 X 256 MBIT FLASH USE OF LICENSED AMI UEFI BIOS PNP 1.0A, DMI 2.7, WFM 2.0, SM BIOS 2.7, ACPI 5.0
FORM FACTOR	MICRO ATX FORM FACTOR; 24.4CM X 24.4CM
AUDIO	REALTEK AUDIO CODEC HIGH DEFINITION AUDIO 2/4/5.1/7.1-CHANNEL * TO CONFIGURE 7.1-CHANNEL AUDIO, YOU NEED TO OPEN THE AUDIO SOFTWARE AND SELECT DEVICE ADVANCED SETTINGS > PLAYBACK DEVICE TO CHANGE THE DEFAULT SETTING FIRST.
EXPANSION SLOTS
PCI	1 X PCI EXPRESS X16 SLOT, RUNNING AT X16 (THE PCIEX16 SLOT CONFORMS TO PCI EXPRESS 4.0 STANDARD.) 2 X PCI EXPRESS X1 SLOTS (THE PCIEX1 SLOTS CONFORM TO PCI EXPRESS 3.0 STANDARD.)
MEMORY
TYPE	DDR4
SLOTS	4 X DDR DIMM SOCKETS
SUPPORTED MEMORY	SUPPORT FOR DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHZ MEMORY MODULES DUAL CHANNEL MEMORY ARCHITECTURE SUPPORT FOR ECC UN-BUFFERED DIMM 1RX8/2RX8 MEMORY MODULES (OPERATE IN NON-ECC MODE) SUPPORT FOR NON-ECC UN-BUFFERED DIMM 1RX8/2RX8/1RX16 MEMORY MODULES SUPPORT FOR EXTREME MEMORY PROFILE (XMP) MEMORY MODULES
MAXIMUM MEMORY	UP TO 128 GB (32 GB SINGLE DIMM CAPACITY) OF SYSTEM MEMORY
GRAPHICS
GRAPHICS	INTEGRATED GRAPHICS PROCESSOR-INTEL HD GRAPHICS SUPPORT: 1 X HDMI PORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2160@60 HZ * SUPPORT FOR HDMI 2.1 VERSION AND HDCP 2.3. ** SUPPORT NATIVE HDMI 2.1 TMDS COMPATIBLE PORTS. 1 X DISPLAYPORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2304@60 HZ * SUPPORT FOR DISPLAYPORT 1.2 VERSION AND HDCP 2.3 1 X DISPLAYPORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2304@60 HZ * SUPPORT FOR DISPLAYPORT 1.2 VERSION. SUPPORT FOR UP TO 3 DISPLAYS AT THE SAME TIME
CONNECTOR & PORTS
HDMI	1 X HDMI PORT
DISPLAY PORT (S)	2 X DISPLAYPORT
USB (S)	CHIPSET: 1 X USB TYPE-C PORT ON THE BACK PANEL, WITH USB 3.2 GEN 2 SUPPORT 5 X USB 3.2 GEN 1 PORTS (3 PORTS ON THE BACK PANEL, 2 PORTS AVAILABLE THROUGH THE INTERNAL USB HEADER) 2 X USB 2.0/1.1 PORTS ON THE BACK PANEL CHIPSET+2 USB 2.0 HUBS: 4 X USB 2.0/1.1 PORTS AVAILABLE THROUGH THE INTERNAL USB HEADERS
LAN PORT (S)	REALTEK 2.5GBE LAN CHIP (2.5 GBPS/1 GBPS/100 MBPS)
WIRELESS COMMUNICATION MODULE	INTEL WI-FI 6 AX201 (FOR PCB REV. 1.0) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5 GHZ DUAL-BAND BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE INTEL WI-FI 6 AX200 (FOR PCB REV. 1.1) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5 GHZ DUAL-BAND BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE INTEL WI-FI 6E AX211 (FOR PCB REV. 1.2) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5/6 GHZ CARRIER FREQUENCY BANDS BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE
SUPPORTED STORAGE	CPU: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2A_CPU) CHIPSET: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2P_SB) 4 X SATA 6GB/S CONNECTORS SUPPORT FOR RAID 0, RAID 1, RAID 5, AND RAID 10 INTEL OPTANE MEMORY READY
AUDIO	3 X AUDIO JACKS
INTERNAL I/O PORTS	1 X 24-PIN ATX MAIN POWER CONNECTOR 1 X 8-PIN ATX 12V POWER CONNECTOR 1 X CPU FAN HEADER 3 X SYSTEM FAN HEADERS 1 X ADDRESSABLE LED STRIP HEADER 1 X RGB LED STRIP HEADER 2 X M.2 SOCKET 3 CONNECTORS 4 X SATA 6GB/S CONNECTORS 1 X FRONT PANEL HEADER 1 X FRONT PANEL AUDIO HEADER 1 X USB 3.2 GEN 1 HEADER 2 X USB 2.0/1.1 HEADERS 1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY) 1 X S/PDIF OUT HEADER 1 X Q-FLASH PLUS BUTTON 1 X RESET BUTTON 1 X RESET JUMPER 1 X CLEAR CMOS JUMPER
TPM (TRUSTED PLATFORM MODULE )	1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY)
WARRANTY INFORMATION
MANUFACTURING WARRANTY	3 YEARS

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GIGABYTE B660M DS3H AX DDR4 INTEL 12TH GENERATION MOTHERBOARD

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Description
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SUPPORTED CPU	LGA1700 SOCKET: SUPPORT FOR 12TH GENERATION INTEL CORE, PENTIUM GOLD AND CELERON PROCESSORS L3 CACHE VARIES WITH CPU
CHIPSET	INTEL B660 EXPRESS CHIPSET
BIOS	1 X 256 MBIT FLASH USE OF LICENSED AMI UEFI BIOS PNP 1.0A, DMI 2.7, WFM 2.0, SM BIOS 2.7, ACPI 5.0
FORM FACTOR	MICRO ATX FORM FACTOR; 24.4CM X 24.4CM
AUDIO	REALTEK AUDIO CODEC HIGH DEFINITION AUDIO 2/4/5.1/7.1-CHANNEL * TO CONFIGURE 7.1-CHANNEL AUDIO, YOU NEED TO OPEN THE AUDIO SOFTWARE AND SELECT DEVICE ADVANCED SETTINGS > PLAYBACK DEVICE TO CHANGE THE DEFAULT SETTING FIRST.
EXPANSION SLOTS
PCI	1 X PCI EXPRESS X16 SLOT, RUNNING AT X16 (THE PCIEX16 SLOT CONFORMS TO PCI EXPRESS 4.0 STANDARD.) 2 X PCI EXPRESS X1 SLOTS (THE PCIEX1 SLOTS CONFORM TO PCI EXPRESS 3.0 STANDARD.)
MEMORY
TYPE	DDR4
SLOTS	4 X DDR DIMM SOCKETS
SUPPORTED MEMORY	SUPPORT FOR DDR4 5333(O.C.)/ DDR4 5133(O.C.)/DDR4 5000(O.C.)/4933(O.C.)/4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/3000/2933/2666/2400/2133 MHZ MEMORY MODULES DUAL CHANNEL MEMORY ARCHITECTURE SUPPORT FOR ECC UN-BUFFERED DIMM 1RX8/2RX8 MEMORY MODULES (OPERATE IN NON-ECC MODE) SUPPORT FOR NON-ECC UN-BUFFERED DIMM 1RX8/2RX8/1RX16 MEMORY MODULES SUPPORT FOR EXTREME MEMORY PROFILE (XMP) MEMORY MODULES
MAXIMUM MEMORY	UP TO 128 GB (32 GB SINGLE DIMM CAPACITY) OF SYSTEM MEMORY
GRAPHICS
GRAPHICS	INTEGRATED GRAPHICS PROCESSOR-INTEL HD GRAPHICS SUPPORT: 1 X HDMI PORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2160@60 HZ * SUPPORT FOR HDMI 2.1 VERSION AND HDCP 2.3. ** SUPPORT NATIVE HDMI 2.1 TMDS COMPATIBLE PORTS. 1 X DISPLAYPORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2304@60 HZ * SUPPORT FOR DISPLAYPORT 1.2 VERSION AND HDCP 2.3 1 X DISPLAYPORT, SUPPORTING A MAXIMUM RESOLUTION OF 4096X2304@60 HZ * SUPPORT FOR DISPLAYPORT 1.2 VERSION. SUPPORT FOR UP TO 3 DISPLAYS AT THE SAME TIME
CONNECTOR & PORTS
HDMI	1 X HDMI PORT
DISPLAY PORT (S)	2 X DISPLAYPORT
USB (S)	CHIPSET: 1 X USB TYPE-C PORT ON THE BACK PANEL, WITH USB 3.2 GEN 2 SUPPORT 5 X USB 3.2 GEN 1 PORTS (3 PORTS ON THE BACK PANEL, 2 PORTS AVAILABLE THROUGH THE INTERNAL USB HEADER) 2 X USB 2.0/1.1 PORTS ON THE BACK PANEL CHIPSET+2 USB 2.0 HUBS: 4 X USB 2.0/1.1 PORTS AVAILABLE THROUGH THE INTERNAL USB HEADERS
LAN PORT (S)	REALTEK 2.5GBE LAN CHIP (2.5 GBPS/1 GBPS/100 MBPS)
WIRELESS COMMUNICATION MODULE	INTEL WI-FI 6 AX201 (FOR PCB REV. 1.0) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5 GHZ DUAL-BAND BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE INTEL WI-FI 6 AX200 (FOR PCB REV. 1.1) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5 GHZ DUAL-BAND BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE INTEL WI-FI 6E AX211 (FOR PCB REV. 1.2) WIFI A, B, G, N, AC, AX, SUPPORTING 2.4/5/6 GHZ CARRIER FREQUENCY BANDS BLUETOOTH 5.2 SUPPORT FOR 11AX 160MHZ WIRELESS STANDARD AND UP TO 2.4 GBPS DATA RATE
SUPPORTED STORAGE	CPU: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2A_CPU) CHIPSET: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2P_SB) 4 X SATA 6GB/S CONNECTORS SUPPORT FOR RAID 0, RAID 1, RAID 5, AND RAID 10 INTEL OPTANE MEMORY READY
AUDIO	3 X AUDIO JACKS
INTERNAL I/O PORTS	1 X 24-PIN ATX MAIN POWER CONNECTOR 1 X 8-PIN ATX 12V POWER CONNECTOR 1 X CPU FAN HEADER 3 X SYSTEM FAN HEADERS 1 X ADDRESSABLE LED STRIP HEADER 1 X RGB LED STRIP HEADER 2 X M.2 SOCKET 3 CONNECTORS 4 X SATA 6GB/S CONNECTORS 1 X FRONT PANEL HEADER 1 X FRONT PANEL AUDIO HEADER 1 X USB 3.2 GEN 1 HEADER 2 X USB 2.0/1.1 HEADERS 1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY) 1 X S/PDIF OUT HEADER 1 X Q-FLASH PLUS BUTTON 1 X RESET BUTTON 1 X RESET JUMPER 1 X CLEAR CMOS JUMPER
TPM (TRUSTED PLATFORM MODULE )	1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY)
WARRANTY INFORMATION
MANUFACTURING WARRANTY	3 YEARS

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GIGABYTE B660M DS3H AX DDR4 INTEL 12TH GENERATION MOTHERBOARD

KEY FEATURES

CPU SOCKET TYPE: LGA 1700

MOTHERBOARD CHIPSET: B660

AUDIO: REALTEK AUDIO CODEC

FORM FACTOR: MICRO ATX

Description

SPECIFICATION

SUPPORTED CPU

LGA1700 SOCKET: SUPPORT FOR 12TH GENERATION INTEL CORE, PENTIUM GOLD AND CELERON PROCESSORS L3 CACHE VARIES WITH CPU

CHIPSET

INTEL B660 EXPRESS CHIPSET

BIOS

1 X 256 MBIT FLASH USE OF LICENSED AMI UEFI BIOS PNP 1.0A, DMI 2.7, WFM 2.0, SM BIOS 2.7, ACPI 5.0

FORM FACTOR

MICRO ATX FORM FACTOR; 24.4CM X 24.4CM

AUDIO

REALTEK AUDIO CODEC HIGH DEFINITION AUDIO 2/4/5.1/7.1-CHANNEL * TO CONFIGURE 7.1-CHANNEL AUDIO, YOU NEED TO OPEN THE AUDIO SOFTWARE AND SELECT DEVICE ADVANCED SETTINGS > PLAYBACK DEVICE TO CHANGE THE DEFAULT SETTING FIRST.

EXPANSION SLOTS

PCI

1 X PCI EXPRESS X16 SLOT, RUNNING AT X16 (THE PCIEX16 SLOT CONFORMS TO PCI EXPRESS 4.0 STANDARD.) 2 X PCI EXPRESS X1 SLOTS (THE PCIEX1 SLOTS CONFORM TO PCI EXPRESS 3.0 STANDARD.)

MEMORY

TYPE

DDR4

SLOTS

4 X DDR DIMM SOCKETS

SUPPORTED MEMORY

MAXIMUM MEMORY

UP TO 128 GB (32 GB SINGLE DIMM CAPACITY) OF SYSTEM MEMORY

GRAPHICS

GRAPHICS

CONNECTOR & PORTS

HDMI

1 X HDMI PORT

DISPLAY PORT (S)

2 X DISPLAYPORT

USB (S)

LAN PORT (S)

REALTEK 2.5GBE LAN CHIP (2.5 GBPS/1 GBPS/100 MBPS)

WIRELESS COMMUNICATION MODULE

SUPPORTED STORAGE

CPU: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2A_CPU) CHIPSET: 1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2P_SB) 4 X SATA 6GB/S CONNECTORS SUPPORT FOR RAID 0, RAID 1, RAID 5, AND RAID 10 INTEL OPTANE MEMORY READY

AUDIO

3 X AUDIO JACKS

INTERNAL I/O PORTS

TPM (TRUSTED PLATFORM MODULE )

1 X TRUSTED PLATFORM MODULE HEADER (FOR THE GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 MODULE ONLY)

WARRANTY INFORMATION

MANUFACTURING WARRANTY

3 YEARS

Reviews

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LGA1700 SOCKET: SUPPORT FOR 12TH GENERATION INTEL CORE, PENTIUM GOLD AND CELERON PROCESSORS
L3 CACHE VARIES WITH CPU

1 X 256 MBIT FLASH
USE OF LICENSED AMI UEFI BIOS
PNP 1.0A, DMI 2.7, WFM 2.0, SM BIOS 2.7, ACPI 5.0

REALTEK AUDIO CODEC
HIGH DEFINITION AUDIO
2/4/5.1/7.1-CHANNEL
* TO CONFIGURE 7.1-CHANNEL AUDIO, YOU NEED TO OPEN THE AUDIO SOFTWARE AND SELECT DEVICE ADVANCED SETTINGS > PLAYBACK DEVICE TO CHANGE THE DEFAULT SETTING FIRST.

1 X PCI EXPRESS X16 SLOT, RUNNING AT X16
(THE PCIEX16 SLOT CONFORMS TO PCI EXPRESS 4.0 STANDARD.)
2 X PCI EXPRESS X1 SLOTS
(THE PCIEX1 SLOTS CONFORM TO PCI EXPRESS 3.0 STANDARD.)

CPU:
1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2A_CPU)
CHIPSET:
1 X M.2 CONNECTOR (SOCKET 3, M KEY, TYPE 2260/2280 PCIE 4.0 X4/X2 SSD SUPPORT) (M2P_SB)
4 X SATA 6GB/S CONNECTORS
SUPPORT FOR RAID 0, RAID 1, RAID 5, AND RAID 10

INTEL OPTANE MEMORY READY